Flyboat lightning-chip varistor (MOV) low-cost irrigation glue Description
To solve the pressure-sensitive mine-chip low-cost epoxy resin casting, I specifically purchased the company in Tianjin Jinqiao Insulation Materials Co., Ltd. tens of kilograms TXH-1156 epoxy potting material, will be my company in 2006 in the first half of approved sub-products remaining extract a few pieces of each sample to 10 the number of films of epoxy potting test results the following table: (left sample has been due to the long putting-damp, encapsulation is not carried out before the drying processing)
| Chip Lot | Potting ago Parameters | Casting process | 5 days curing parameters | 15 days curing parameters | Notes | |||
| U 1mA | I L (μA) | U 1mA | I L (μA) | U 1mA | I L (μA) | |||
| 0601-1 | 615V | 8.3 | 120ml gel +30 ml curing agent (volume ratio 4:1, weight ratio 100:10), and mix thoroughly 8min, room temperature curing. | 616V | 7.3 | 617 | 6.2 | |
| 608V | 11.4 | 611V | 9.5 | 610 | 9.1 | |||
| 632V | 6.4 | 626V | 5.8 | 625 | 5.0 | |||
| 637V | 7.4 | 638V | 6.5 | 639 | 6.0 | |||
| 0603-3 | 702V | 10.5 | 703V | 9.3 | 705 | 8.4 | ||
| 705V | 18.1 | 712V | 14.0 | 709 | 12.6 | |||
| 716V | 18.7 | 722V | 17.6 | 720 | 15.5 | |||
| 705V | 13.3 | 708V | 8.4 | 707 | 7.8 | |||
| 725V | 16.9 | 729V | 15.1 | 728 | 13.6 | |||
| 0604-1 | 705V | 12.4 | 704V | 10.1 | 706 | 9.4 | ||
| 693V | 8.6 | 692V | 6.4 | 695 | 6.5 | |||
| 716V | 18.7 | 713V | 15.2 | 716 | 13.3 | |||
| 0604-5 | 673V | 7.5 | 673V | 6.7 6.7 | 674 674 | 6.3 | ||
| 676V | 13.5 | 677V | 11.3 | 677 | 10.8 | |||
| 669V | 7.2 | 670V | 6.1 | 671 | 5.8 | |||
| 660V | 10.6 | 661V | 8.8 | 664 | 8.8 | |||
| 666V | 9.7 | 667V | 7.1 | 667 | 6.7 | |||
| 0605-A2 | 664V | 6.2 | 200ml gel +40 ml curing agent (volume ratio 5:1, weight ratio of 100:8), and mix thoroughly 10min, room temperature curing. | 656V | 4.5 | 659 | 3.6 | |
| 670V | 16.5 | 667V | 5.7 | 668 | 5.4 | |||
| 657V | 13.0 | 653V | 5.1 | 647 | 5.1 | |||
| 663V | 8.0 | 660V | 5.1 | 659 | 5.0. | |||
| 663V | 8.6 | 663V | 5.8 | 654 | 5.8 | |||
| 652V | 8.8 | 652V | 5.6 | 663 | 5.4 | |||
| 666V | 5.1 | 660V | 5.0 | 653 | 5.0 | |||
The results can be seen from the above: As long as the proportion of appropriate technology is correct, can be used to reduce the user-made epoxy resin casting cost (the other properties of rubber user-authentication). My company filling plastic processes are as follows:
Before the first chip encapsulation under 120 ℃ drying 30 to 60 minutes; rubber, curing agent in accordance with 5:1 volume ratio (100g: 8g = 8ml weight ratio) with a good mix thoroughly, and mix thoroughly how to adjust the amount of time under the gum, but it should be ensure the full mix well; and then proceed to filling glue. Kaifeng, a longer time if the glue should be heated to glue 80 ~ 100 ℃, thermal insulation of about 30min in order to drive out moisture, cooling and curing agent and then allocated in proportion to the use of a good mix thoroughly. Potting after basic curing the product placed in the oven for 85 ~ 100 ℃ heat insulation 30 ~ 60 minutes.
Use of other adhesive is also important to note that the user reduce the ratio of curing agent is generally from the manufacturers recommended ratio of 1 / 2 or so begin to try and curing agent dosage should not exceed manufacturer’s recommended maximum ratio of 2 / 3.